Intel and Micron has jointly announced their 3D NAND technology, the world’s highest-density flash memory which can pack as much as 3 times the current NAND technologies used to manufacture SSD drives.
While current SSD are still a bit expensive than usual HDD storage, Micron promises that the new ones will be more cost-effective.
- 3D NAND technology uses floating gate cells and enables the highest-density flash device ever developed—three times higher capacity than other NAND die in production.
- Enables gum stick-sized SSDs with more than 3.5 terabytes (TB) of storage and standard 2.5-inch SSDs with greater than 10TB.
- Innovative process architecture techniques extend Moore’s Law for flash storage, bringing significant improvements in density while lowering the cost of NAND flash.
Intel and Micron are making samples of 256Gb MLC version of 3D NAND to show its true capacity and potential. Full production is expected to start by 4th quarter of this year.
Currently, the biggest SSD available in the market today is the SanDisk Optimus MAX at 4TB but it also comes with a hefty price tag of Php280,000.
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